PCN/PDN/NRND Information STM32F205RBT6｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2021/12/20	PCN(Product Change Notice)	STM32F209 1Mb product improvement Description of change Old Current die revision: - STM32F209 1MB rev2 (Cut 2.4) in ST Crolles CRL300 (France) - STM32F209 1MB rev3 (Cut 2.5) in TSMC Fab14 (Taiwan) Current RM0033 Rev 8 - Reference Manual STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced Arm-based 32-bit MCUs New New die revision to improve manufacturing efficiency: - STM32F209 1MB rev5 (Cut 2.6) in ST Crolles CRL300 (France) - STM32F209 1MB rev4 (Cut 2.6) in TSMC Fab14 (Taiwan) New RM0033 Rev 9 - Reference Manual - february 2021 STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced Arm-based 32-bit MCUs Anticipated Impact on form,fit, function, quality, reliability or processability? No impact on Form, Fit or Function Timing / schedule Date of qualification results 2021-05-14 Intended start of delivery 2021-12-20
2021/12/20	PCN(Product Change Notice)	Die redesign: Mask or mask set change with new die design - Design changes in active elements. Manufacturing Location: TSMC Fab14 (Taiwan)/ Crolles(France) Current die revision: - STM32F209 1MB rev2 (Cut 2.4) in ST Crolles CRL300 (France) - STM32F209 1MB rev3 (Cut 2.5) in TSMC Fab14 (Taiwan) Current RM0033 Rev 8 - Reference Manual STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced Arm-based 32-bit MCUs New die revision to improve manufacturing efficiency: - STM32F209 1MB rev5 (Cut 2.6) in ST Crolles CRL300 (France) - STM32F209 1MB rev4 (Cut 2.6) in TSMC Fab14 (Taiwan) New RM0033 Rev 9 - Reference Manual - february 2021 STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced Arm-based 32-bit MCUs Timing / schedule Date of qualification results 2021-05-14 Intended start of delivery 2021-12-20
2022/05/08	PCN(Product Change Notice)	NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08
2023/05/15	PCN(Product Change Notice)	ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x and STM32H5/H7x listed products Timing / schedule Intended start of delivery 2023-05-15
2024/09/02	PCN(Product Change Notice)	Supplier Notice No.:24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products Description of change: Old/Marking composition with no 2D marking New/New marking composition with 2D marking for production assembly Motivation: to enhance traceability Intended start of delivery: 2024-09-02
2024/12/04	PCN(Product Change Notice)	Supplier Notice No.:MICROCONTROLLERS/24/15033 Title: JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change Intended start of delivery: 2024-12-04 Intended start of delivery 2024-12-04
2024/12/04	PCN(Product Change Notice)	JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
2025/02/03	PCN(Product Change Notice)	Supplier Notice No.:PCN MDG/24/14976 Title: JSCC (China) LQFP7x7 48L , LQFP10x10 64L package copper palladium bonding wire introduction on STM32F2x, STM32F4x and STM32F7x listed products Description: Old/ Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire New/ Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire Added Wire bonding material : - JSCC (China) Copper Palladium wire Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function Intended start of delivery: 2025-02-03
2025/05/20	PCN(Product Change Notice)	ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x Description of change Old Current assembly sites (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. You may refer to 15271_Additional information.pdf document for further details. New Current assembly sites: (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. Additional assembly site for extended capacity: - ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
2025/07/03	PCN(Product Change Notice)	PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3) old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
2025/07/18	PCN(Product Change Notice)	PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter) Timing / schedule Intended start of delivery 2025-08-18
2025/09/02	PCN(Product Change Notice)	ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
2025/09/02	PCN(Product Change Notice)	Supplier Notice No.:MDG/24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly Motivation: to enhance traceability Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change Intended start of delivery: 2025-09-02
2025/12/15	PCN(Product Change Notice)	PCN No.:EMBEDDED PROCESSING/25/15423 Change Desc.:JSCC (China) additional source for legacy STM32F2x and STM32F4x listed products in LQFP 10x10 64L package Intended start of delivery: 2025-12-15
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PCN/PDN/NRND Information

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