| 2020/08/13 |
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PCN(Product Change Notice)
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Product/Process Change Notice ADI is transferring some of the products currently manufactured using the 0.6μm BICMOS process from wafer fab facility located at 275 S. Hillview Dr., Milpitas, CA, USA to Vanguard International Semiconductor, Taiwan. See Appendix 1 for the list of affected part numbers. The affected products will be manufactured using ADI specified manufacturing flows, materials, process controls, and monitors ensuring no degradation of quality and reliability performance. No new products are being released in the Hillview wafer fab and all affected products will be transferred to the Vanguard wafer fab by the end of calendar year 2020 and will cease to be manufactured in the Hillview facility by February 2021. |
| 2021/08/11 |
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PCN(Product Change Notice)
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Notification of Wafer Fab Location Change for 0.6μm BICMOS Process Devices from ADI Milpitas (Hillview) to Vanguard Int. (Taiwan) Effectivity Date: 30-Oct-2021 |
| 2022/03/05 |
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PCN(Product Change Notice)
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LTC4417 Datasheet Limit Change Effectivity Date: 05-Mar-2022
Description Of Change: Please be advised that Analog Devices has made a minor changes to the LTC4417 product datasheet to facilitate improvement in manufacturing capability. |
| 2022/04/24 |
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PCN(Product Change Notice)
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Addition of Alternate Assembly Site ASE Taiwan for Select LFCSP Products Effectivity Date: 24-Apr-2022 |