| 2020/03/10 |
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PCN(Product Change Notice)
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JSCC capacity increase - for listed products [Old] Silver wire bonding
[New] Silver wire bonding Gold wire bonding |
| 2020/06/12 |
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PCN(Product Change Notice)
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For StatsChipPAC JSCC Jiangyin China capacity increase Silver wire bonding > Silver wire bonding + Gold wire bonding |
| 2020/09/01 |
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PCN(Product Change Notice)
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STM32WB 1M Firmware Upgrade Service - new version for listed products |
| 2021/01/08 |
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PCN(Product Change Notice)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/06/15 |
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PCN(Product Change Notice)
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Old : STM32WB 1M Firmware Upgrade Service, FUS version V1.1.1, All details are listed in Application Note, AN5185 - Revision 4 - March 2020 New : STM32WB 1M Firmware Upgrade Service, FUS version V1.2.0,New Feature implemented: Protection improvement added, All details are listed in Application Note AN5185 - Revision 5 - May 2021 |
| 2022/05/08 |
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PCN(Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/05/16 |
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PCN(Product Change Notice)
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STM32WB5x and STM32WB3x - product enhancement Timing / schedule Intended start of delivery 2022-05-16 |
| 2025/10/10 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15269 Change Desc.:JSCC (China) STM32WB1x, STM32WB3x/5x, STM32WBA5x and STM32WL5x/LEx listed RF Products wire bonding conversion for UFQFPN5x5/7x7 and VFQFPN8x8 packages. |
| 2026/01/04 |
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PCN(Product Change Notice)
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PCN No. EMBEDDED PROCESSING/25/15632 Change Desc. Reason FUS update from v1.2.0 to v2.2.0 (cumulated enhancements from v2.0.0 and v2.1.0 and v2.2.0) / SafeBoot update to v2.0.1. • Add data migration feature during wireless stack update (to preserve BLE bonding / pairing data during the update) • Robustness improvements • Enhanced Security, SA0024 remains applicable
Intended start of delivery 2026-01-04
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