| 2022/07/21 |
|
PCN(Product Change Notice)
|
Press Fit contacts used on the listed Multigig connectors are currently stamped~and plated at Outside Vendors. An additional Outside vendor has been qualified~for the Plating process. |
| 2023/01/04 |
|
PCN(Product Change Notice)
|
Increase the width of the wafer slots on the housing(Shroud) by 0.09mm in order~to reduce the risk of FOD (Foreign Object Debris) that can be generated by~insertion of the PWB wafers during parts assembly |
| 2023/04/16 |
|
PCN(Product Change Notice)
|
Adding a new mold cavity for the organizer. |
| 2024/01/15 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:EPCN-338938
Title:
Quality Alert / NOSP 23-053 ? Notice of Suspect Product
Description of Non-Compliance:
Through customer notification, we have identified that gold plating on the Printed Circuit Boards internal to the Daughtercard connectors may flake when adhesion testing (i.e., tape testing per IPC 6012E) is performed.
Containment and Corrective action:
We are in the process of conducting a thorough investigation of the issue, and you can expect an update no later than January 15, 2024. |
| 2024/03/20 |
|
PCN(Product Change Notice)
|
Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This~change does not have an impact on performance and does not cause compatibility~issues. Previous change increased the slot width to 0.45mm but did not remove~the chamfered profile in the slot, which was later determine to be the root~cause of the FOD in our assembly process. |
| 2024/06/24 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:NOE-23-053#5
Title:
STATUS CHANGE: Quality Alert / NOSP 23-053 ? Notice of Suspect Product to NOE-23-053 ? Notice of Escape
In December 2023, TE Connectivity (TE) sent NOSP-23-053 to document a notification of suspect product. We are sending this update to inform you of a change in status. We regret to send this Notice of Escape (NOE) on Multigig Daughtercard connectors.
Description of Non-Compliance:
Through customer notification, we have identified that gold plating on the Printed Circuit Boards internal to the Daughtercard connectors may flake when adhesion testing (i.e., tape testing per IPC 6012E) is performed.
Disposition of Non-Conformity:
As a next step, we advise you to take the following actions with the non-conforming material:
? Please quarantine at location and await further instructions TE |
| 2024/09/13 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:NOE-23-053#8
Title:
NOE-23-053 ? Multigig Daughtercard Connectors ? Update
Update Summary:
?TE has expanded the scope of this Notice of Escape to date code range 2107 through 2408
?The root cause, failure mode, and corrective action remain the same
?TE will provide a testing progress update on or before October 28, 2024
Description:
This letter is an update to Notice of Escape (NOE) 23-053 on Multigig Daughtercard connectors. While the failure mode and corrective action have not changed, TE Connectivity (TE) has revised the date code range of affected connectors. Your organization may be receiving this notice for the first time because of this expanded investigation.
|
| 2024/10/03 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:NOE-23-053#9
Title:
NOE-23-053 ? Multigig Daughtercard Connectors ? Update
Update Summary:
?TE has expanded the scope of this Notice of Escape to date code range 2107 through 2408
?The root cause, failure mode, and corrective action remain the same
?TE will provide a testing progress update on or before October 28, 2024
|
| 2024/11/15 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:NOE-23-053#10
Title:
NOE-23-053 ? Multigig Daughtercard Connectors ? Update
Update Summary:
?Our supplier is conducting tests to identify root cause of the PCB tape test failure reported in ourprevious update. We expect results in late November 2024.
?Our supplier has provided on-site resources to 100% tape test current inventory of PCBs withTE supervision. No additional tape test failures have been identified to date.
?Our Risk Assessment testing is ongoing. The planned completion date is December 12, 2024.
?We will continue to supply parts that have been produced using 100% tape tested wafers and/ormaterial from an alternate supplier.
Risk Assessment
TE’s previously communicated risk assessment testing is ongoing, with a planned completion date of December 12, 2024. To date, we have not observed any flaking or identified performance issues against product specifications. |
| 2024/12/06 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:NOE-23-053#11
Title:
NOE-23-053 ? Multigig Daughtercard Connectors ? Update
Update Summary:
?Our supplier has completed initial testing to identify root cause, and this testing wasinconclusive. Additional testing is in progress. We expect completion by December 13, 2024.
?While the supplier’s root cause investigation is ongoing, TE has identified that the original issueis localized to a specific area of the PCB panel. We are reviewing samples from completed riskassessment testing to determine if additional testing is warranted.
?
Our supplier has completed their on-site assessment of TE’s current inventory of PCBs. Noadditional tape test failures were identified during this review.
?Our risk assessment testing is complete. Results showed that product performed per the TEProduct Specification.
?We will continue to supply parts that have been produced using 100% tape tested wafers and/ormaterial from an alternate supplier.
|
| 2024/12/20 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:NOE-23-053#12
Title:
NOE-23-053 ? Multigig Daughtercard Connectors ? Update
Update Summary:
?Our supplier has completed initial testing to identify root cause, and this testing wasinconclusive. Additional testing is in progress but was not completed by the December 13 targetdate stated in our previous letter. We will provide another update in January 2025.
?Our risk assessment testing is complete. Results showed that product performed per the TEProduct Specification. A report describing the testing and results is available upon request.
?Because tested product performed per the Product Specification, TE Connectivity (TE) isrecommending a use-as-is disposition. |
| 2025/02/04 |
|
PCN(Product Change Notice)
|
Updated document, Reason of update: Alert - TE Connectivity identified a gold~flaking issue in specific batches of Multigig Daughtercard connectors,~potentially causing short circuits or increased resistance. The affected date~range was adjusted, and 100% tape testing was implemented. TE recommends a~use-as-is disposition and has resumed shipments. |
| 2025/03/04 |
|
PCN(Product Change Notice)
|
Alert - Gaps in Group A testing and change management for MIL-PRF-83536,~MIL-DTL-83725, and MIL-PRF-83726 have been addressed. The DLA has approved~resumption of normal shipments as of February 28, 2025. |
| 2025/05/08 |
|
PCN(Product Change Notice)
|
We would like to inform you that we will be changing the shape of the hole
in the affected products to improve the product.
Implementation period: 2025/08/08 Shipment ~ Running change
|
| 2025/10/15 |
|
PCN(Product Change Notice)
|
PCN No.:P-25-029003
Change Desc.:Outside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA.
REASON FOR CHANGE:
New manufacturing facility.
FIRST DATE TO SHIP CHANGED PARTS:
15-OCT-2025 |
| 2025/11/17 |
|
PCN(Product Change Notice)
|
To improve the product, the plating specifications(Gold>PdNi+Gold Flash) and coverage area have been changed. |
