| 2023/07/07 |
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PCN(Product Change Notice)
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Revision of Package Outline Drawing (POD) for LFCSP, particularly on the flange~(A3 feature) to include 0.3mm flange thickness as additional option to the~0.2mm flange thickness. Data Sheet revision. |
| 2023/09/28 |
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PCN(Product Change Notice)
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Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor Effectivity Date: 28-Sep-2023 (the earliest date that a customer could expect to receive changed material) |
| 2024/02/08 |
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PCN(Product Change Notice)
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Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor Revision Description: 1) Update Package Outline Drawing List Attachment and Device list. 2) Removed parts. AD9239BCPZ-170 AD9239BCPZ-250 AD9639BCPZ-170 AD9639BCPZRL-170 AD9780BCPZ AD9780BCPZRL AD9781BCPZ AD9781BCPZRL AD9783BCPZ AD9783BCPZRL |
| 2025/12/18 |
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PCN(Product Change Notice)
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PCN No. PCN 24_0009 Rev. F Change Desc. Revision Description: Add parts. Analog Device is adding Analog Devices Beaverton OR, USA (ADBN) as an alternate Wafer Fab site to TSMC Taiwan for 0.18um Mixed Signal CMOS Process. |
| 2026/01/07 |
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PCN(Product Change Notice)
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PCN No.: PCN 24_0009 Rev. H Change Desc.:Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process. Analog Device is qualifying Analog Devices BeavertonOR,USA(ADBN) as an alternate Wafer Fab site for 0.18umMixed Signal CMOS Process.
Reason For Change: This change will ensure manufacturing agility and continuity of suppl
Revision Description: Minor correction to the PCN description for improved accuracy. |