| 2020/08/25 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION SUMMARY |
| 2020/10/01 |
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PCN(Product Change Notice)
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Change Type: Assembly & Test Site Change / Part Top Marking Rev 2: Added Table 4 below identifying package outline dimension changes for SOT-23, SOT-323 and SOT-363 packages
|
| 2021/07/01 |
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PCN(Product Change Notice)
|
Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| 2023/08/03 |
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PCN(Product Change Notice)
|
Addition of a Polyimide Wafer Coating Layer and Enhanced ESD Structure for DMP10H4D2S Products Implementation Date:3 August, 2023 |
| 2023/08/03 |
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PCN(Product Change Notice)
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Rev 2: Updated the attached (embedded) PCN Qualification Report Addition of a Polyimide Wafer Coating Layer and Enhanced ESD Structure for DMP10H4D2S Products Implementation Date:3 August, 2023 |
| 2023/08/03 |
|
PCN(Product Change Notice)
|
Addition of a Polyimide Wafer Coating Layer and Enhanced ESD Structure for DMP10H4D2S Products Implementation Date: 3 August, 2023 |