| 2021/01/27 |
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PCN(Product Change Notice)
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Change of wafer production location from Infineon Technologies Temecula, USA to EPISIL Technologies Inc., Taiwan for several Gen5.0 and Gen 7.0 MOSFET |
| 2021/01/29 |
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PCN(Product Change Notice)
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Change of wafer production location from Infineon Technologies Temecula, USA to EPISIL Technologies Inc., Taiwan for several Gen5.0 and Gen 7.0 MOSFET |
| 2021/11/15 |
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PCN(Product Change Notice)
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Removal of legacy International Rectified (IR) logo from tube and packing box affecting products from assembly location Rectificadores Internacionales, S.A. de C.V., Tijuana , Mexico. Reason: Standardization of packing material across Infineon sites
Description Old: Outer packing box and plastic tube with legacy IR logo New: Legacy IR logo removed from packing box and plastic tube |
| 2024/02/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN 2023-092-A Title: Change of the wafer production location from Infineon Technologies Temecula, USA to Infineon Technologies Kulim, Malaysia for dedicated G5 P-Channel MOSFET products
Reason: The wafer production of the affected products will be extended to Infineon Technologies Kulim, according to global Infineon production strategy
Impact of change: No
Intended start of delivery: February 2024 or based on customer approval |
| 2024/04/15 |
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PCN(Product Change Notice)
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Supplier Notice No.:2023-092-B Title: Change of the wafer production location from Infineon TechnologiesTemecula, USA to Infineon Technologies Kulim, Malaysia for dedicated G5 P-Channel MOSFET products.
Reason: The wafer production of the affected products will be extended to Infineon Technologies Kulim, according to global Infineon production strategy.
Impact of change: NO
Intended start of delivery: 2024-04-15 |
| 2024/06/19 |
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PCN(Product Change Notice)
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Supplier Notice No.:INF_024_24 Title: Moisture Barrier Bag and Anti-Static shielding bag elimination for MSL1 devices at Tijuana, Mexico.
Reason: Standardization of packing material for MSL1 devices at Tijuana, Mexico.
Description: Packing material & method:Old/ ? Moisture Barrier Bag +Humidity Indicator Card +Desiccant + Dry Pack and ? Anti-Static shielding bag + Dry Pack
Packing material & method:New/ ? Reel in packing box without Dry Pack
Impact of change: No impact on electrical performance as the change belongs to the standardization of packing material and method for MSL1 devices.
Intended start of delivery: 2024-06-19 |
| 2024/06/19 |
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PCN(Product Change Notice)
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Supplier Notice No.:024/24 Title: Moisture Barrier Bag and Anti-Static shielding bag elimination for MSL1 devices at Tijuana, Mexico
Description: Packing material & method/Old ? Moisture Barrier Bag + Humidity Indicator Card +Desiccant + Dry Pack and ? Anti-Static shielding bag +Dry Pack
Packing material & method/New ? Reel in packing box without Dry Pack
Impact of change: No impact on electrical performance as the change belongs to the standardization of packing material and method for MSL1 devices.
Intended start of delivery: 2024-06-19 |