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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2021/01/27 PCN(Product Change Notice) Change of wafer production location from Infineon Technologies Temecula, USA
to EPISIL Technologies Inc., Taiwan for several Gen5.0 and Gen 7.0 MOSFET
2021/01/29 PCN(Product Change Notice) Change of wafer production location from Infineon Technologies Temecula,
USA to EPISIL Technologies Inc., Taiwan for several Gen5.0 and Gen 7.0
MOSFET
2021/11/15 PCN(Product Change Notice) Removal of legacy International Rectified (IR) logo from tube
and packing box affecting products from assembly location Rectificadores
Internacionales, S.A. de C.V., Tijuana , Mexico.
Reason: Standardization of packing material across Infineon sites

Description
Old: Outer packing box and plastic tube with legacy IR logo
New: Legacy IR logo removed from packing box and plastic tube
2024/02/01 PCN(Product Change Notice) Supplier Notice No.:PCN 2023-092-A
Title:
Change of the wafer production location from Infineon Technologies Temecula, USA to Infineon Technologies Kulim, Malaysia for dedicated G5 P-Channel MOSFET products

Reason:
The wafer production of the affected products will be extended to Infineon Technologies Kulim, according to global Infineon production strategy

Impact of change:
No

Intended start of delivery:
February 2024 or based on customer approval
2024/04/15 PCN(Product Change Notice) Supplier Notice No.:2023-092-B
Title:
Change of the wafer production location from Infineon TechnologiesTemecula, USA to Infineon Technologies Kulim, Malaysia for dedicated G5 P-Channel MOSFET products.

Reason:
The wafer production of the affected products will be extended to Infineon Technologies Kulim, according to global Infineon production strategy.

Impact of change:
NO

Intended start of delivery:
2024-04-15
2024/06/19 PCN(Product Change Notice) Supplier Notice No.:INF_024_24
Title:
Moisture Barrier Bag and Anti-Static shielding bag elimination for MSL1 devices at Tijuana, Mexico.

Reason:
Standardization of packing material for MSL1 devices at Tijuana, Mexico.

Description:
Packing material & method:Old/
? Moisture Barrier Bag +Humidity Indicator Card +Desiccant + Dry Pack and
? Anti-Static shielding bag + Dry Pack

Packing material & method:New/
? Reel in packing box without Dry Pack

Impact of change:
No impact on electrical performance as the change belongs to the standardization of packing material and method for MSL1 devices.

Intended start of delivery:
2024-06-19
2024/06/19 PCN(Product Change Notice) Supplier Notice No.:024/24
Title:
Moisture Barrier Bag and Anti-Static shielding bag elimination for MSL1 devices at Tijuana, Mexico

Description:
Packing material & method/Old
? Moisture Barrier Bag + Humidity Indicator Card +Desiccant + Dry Pack and
? Anti-Static shielding bag +Dry Pack

Packing material & method/New
? Reel in packing box without Dry Pack

Impact of change:
No impact on electrical performance as the change belongs to the standardization of packing material and method for MSL1 devices.

Intended start of delivery:
2024-06-19
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PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Product & Sales Information of products subject to notification

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