| 2020/09/08 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION |
| 2020/09/09 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION |
| 2020/10/01 |
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PCN(Product Change Notice)
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MCU/SOC (GP products) announcement of Full carton |
| 2021/04/01 |
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PCN(Product Change Notice)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing change from Fractional Tray to Full Carton : Shipments from REA of devices in Full Cartons begins. October 1, 2020 |
| 2021/04/01 |
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PCN(Product Change Notice)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing form with a tray from fraction to Full Carton (full packing) : Full Carton shipment will become standard, combining max. 3 lot codes worst case |
| 2022/06/01 |
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PCN(Product Change Notice)
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Addition of mold compound supplier Schedules: Change Implementation : June 2022 |
| 2022/06/01 |
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PCN(Product Change Notice)
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We will add a sealing resin supplier. It will be added at any time from the production after June 1st. |
| 2024/10/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:PC-MCU-A030A Title: Addition of full tray packaging for MCU products(RX/RA/Synergy)
Description of Change: Renesas will add full tray packaging to MCU products in addition to fractional and full carton. The standard shipping packaging using Renesas trays is a full carton (complete packaging). However, if the customer's order quantity is less than a full carton, we will change it to the full tray that will be added this time.
Reason for Change: Stable supply of products, environmentally friendly response (improving packaging resource usage efficiency,reducing waste amount)
Effective Date: 10/1/2024 |
| 2024/10/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:EE-QR-240625-01 Title: Renesas will add full tray packaging to MCU products in addition to fractional and full carton.
Description of Change: Renesas will add full tray packaging to MCU products in addition to fractional and full carton. The standard shipping packaging using Renesas trays is a full carton (complete packaging). However, if the customer's order quantity is less than a full carton, we will change it to the full tray that will be added this time.
Reason for Change: Stable supply of products, environmentally friendly response (improving packaging resource usage efficiency, reducing waste amount)
Schedules: Change Implementation: 1. October 2024 |
| 2025/03/01 |
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PCN(Product Change Notice)
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Supplier Notice No.: Title: Notice of Change of Die-Bond Material for RA, SYNERGY and RX Surface-Mount Package Productsa
Description of Change: The back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (“Suzhou”). Changes: The die-bond material will be changed. The new die-bond material is a proven one for mass production at “Suzhou”.
Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Impact on Fit, Form, Function, Quality & Reliability: This change will not affect fitting, form, function, quality, and reliability.
Effective Date: 3/1/2025 |
| 2025/03/01 |
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PCN(Product Change Notice)
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NOTICE OF CHANGE OF DIE-BOND MATERIAL FOR RA, SYNERGY AND RX SURFACE-MOUNT PACKAGE PRODUCTS |