| 2021/01/08 |
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PCN(Product Change Notice)
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MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of Change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
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| 2021/09/24 |
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PCN(Product Change Notice)
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OLD: IP FE ISOLATION: 1.7KV ASSY plant: SHENZEN (BOM 1F137576) FT plant: AGRATE DS version 1 NEW: IP FE ISOLATION: 6KV ASSY plant: ASE (BOM 1F142589) FT plant: MUAR DS version 2 |
| 2021/09/24 |
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PCN(Product Change Notice)
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Product transfer from one site to another site, even if test or process line is qualified ASSY plant: ASE / FT plant: MUAR on STGAP2S. |
| 2025/08/18 |
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PCN(Product Change Notice)
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PCN No. CRP/25/15292 Change Desc. Additional 2D in ST Standard Inner Bulk Label (APMS perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2026/05/29 |
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PCN(Product Change Notice)
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Supplier Notice No.:CRP/25/15383 Title:(2/4)ST manufacturing reshaping program - Corporate PCI - Early Notification
Description of change: Old/ST manufacturing landscape New/Reshaping of ST’s manufacturing footprint by end 2027
Anticipated Impact on form,fit,function, quality, reliability or processability? Form : no impact Fit : no impact Function : no impact Reliability : no impact Processability : no impact
Intended start of delivery: 2026-05-29 |
| 2027/10/31 |
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PCN(Product Change Notice)
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PDN No.: ANALOG MEMS SENSORS/25/15580 Description: ST Manufacturing Reshaping (Analog_BCD6 Galvanics_AG200toSG8_All): Qualification of SG8 (Singapore) as new FE Location. |