PCN/PDN/NRND信息 AD7192BRUZ-REEL｜半导体和电子元器件分销商 - chip1stop

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2024/05/06	PCN(Product Change Notice)	Qualification of an Alternate Wafer Fab Site for 0.5um TSMC CMOS Process Description Of Change: 1) Analog Devices is adding Analog Devices, Ireland (ADLK) as an alternate Wafer Fab site to TSMC Fab9 and TSMC Fab2B for 0.5um CMOS Process. 2) Changed to wafer diameter from 6"" to 8"" for select parts.
2024/05/06	PCN(Product Change Notice)	Supplier Notice No.:PCN 23_0143 Rev. - Title: Qualification of an Alternate Wafer Fab Site for 0.5um TSMC CMOS Process Description Of Change: 1) Analog Devices is adding Analog Devices, Ireland (ADLK) as an alternate Wafer Fab site to TSMC Fab9 and TSMC Fab2B for 0.5um CMOS Process. 2) Changed to wafer diameter from 6"" to 8"" for select parts. Refer to substrate changed detail table in the Supporting Documents section of this PCN. Reason For Change: This change will ensure manufacturing agility and continuity of supply. Impact of the change (positive or negative) on fit, form, function & reliability: There is no impact to fit, form, function or reliability. Effectivity Date: 06-May-2024 (the earliest date that a customer could expect to receive changed material)
2024/05/06	PCN(Product Change Notice)	Description Of Change: 1) Analog Devices is adding Analog Devices, Ireland (ADLK) as an alternate Wafer Fab site to TSMC Fab9 and TSMC Fab2B for 0.5um CMOS Process. 2) Changed to wafer diameter from 6"" to 8"" for select parts. Revision Description: Update reliability report (rev C).
2024/05/06	PCN(Product Change Notice)	Supplier Notice No.:PCN 23_0143 Rev. A Title: Qualification of an Alternate Wafer Fab Site for 0.5um TSMC CMOS Process Description Of Change: 1) Analog Devices is adding Analog Devices, Ireland (ADLK) as an alternate Wafer Fab site to TSMC Fab9 and TSMC Fab2B for 0.5um CMOS Process. 2) Changed to wafer diameter from 6"" to 8"" for select parts. Refer to substrate changed detail table in the Supporting Documents section of this PCN. Reason For Change: This change will ensure manufacturing agility and continuity of supply. Impact of the change (positive or negative) on fit, form, function & reliability: There is no impact to fit, form, function or reliability. Effectivity Date: 06-May-2024 (the earliest date that a customer could expect to receive changed material) Revision Description: Update reliability report (rev C).
2025/10/03	PCN(Product Change Notice)	PCN No.:PCN 25_0162 Rev. - Change Desc.:Gold to Copper Wire Conversion Change of bond wire from Gold wire to Copper wire for all the parts listed, in specific subcon. BOM also updated to be compatible with Cu wire. ASECL: BOM compound G700LA and Die attach EN4900G. ATP: compound is Sumitomo G700LS and Die attach AB8290. UTAC: compound is G700LTD and Die attach AB8600. All materials have qualified and in production for ADI devices. Reason For Change: The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives. Note: ASE, Amkor, UTAC, all have been in Cu wire production for 10+ years and over billion units shipped to commercial and automotive customers. Effectivity Date: 03-Oct-2025 (the earliest date that a customer could expect to receive changed material)
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Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

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Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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