| 2021/02/09 |
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PCN(Product Change Notice)
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Manufacturing Change : a new lead frame design |
| 2021/12/01 |
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PCN(Product Change Notice)
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a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site. |
| 2022/02/01 |
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PCN(Product Change Notice)
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Product Change Notification Date: 01-Feb-2022
CCB 4539 Cancellation Notice: For the qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site |
| 2022/02/28 |
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PCN(Product Change Notice)
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Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:February 28, 2022 |
| 2022/03/30 |
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PCN(Product Change Notice)
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CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:March 30, 2022 |
| 2025/04/10 |
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PCN(Product Change Notice)
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Microchip has released a new Datasheet for the 24AA16/24LC16B/24FC16 - 16-Kbit I2C Serial EEPROM of devices. Description of Change: Updated Q6B package outline drawing; Minor editorial updates throughout the document. |
| 2025/07/22 |
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PCN(Product Change Notice)
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PDN No.: BLAS-25TFGQ302 Description: CCB 7626 Final Notice: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package. |
| 2025/07/22 |
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PCN(Product Change Notice)
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PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 1/9th notification. |
| 2025/10/02 |
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PCN(Product Change Notice)
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PDN No.: SYST-01TQDH624 Description: Data?Sheet - 24AA16/24LC16B/24FC16 - 16-Kbit I2C?Serial EEPROM |