PCN/PDN/NRND Information STM32F207IEH6｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2021/01/08	PCN(Product Change Notice)	PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2021/03/11	PCN(Product Change Notice)	AMKOR ATP (Philippines) enhanced Die Attach (new material) - All listed product in UFBGA package
2021/06/15	PCN(Product Change Notice)	Old> marking composition with no SS marking New> marking composition with additional SS marking
2021/12/20	PCN(Product Change Notice)	STM32F209 1Mb product improvement Description of change Old Current die revision: - STM32F209 1MB rev2 (Cut 2.4) in ST Crolles CRL300 (France) - STM32F209 1MB rev3 (Cut 2.5) in TSMC Fab14 (Taiwan) Current RM0033 Rev 8 - Reference Manual STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced Arm-based 32-bit MCUs New New die revision to improve manufacturing efficiency: - STM32F209 1MB rev5 (Cut 2.6) in ST Crolles CRL300 (France) - STM32F209 1MB rev4 (Cut 2.6) in TSMC Fab14 (Taiwan) New RM0033 Rev 9 - Reference Manual - february 2021 STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced Arm-based 32-bit MCUs Anticipated Impact on form,fit, function, quality, reliability or processability? No impact on Form, Fit or Function Timing / schedule Date of qualification results 2021-05-14 Intended start of delivery 2021-12-20
2021/12/20	PCN(Product Change Notice)	Die redesign: Mask or mask set change with new die design - Design changes in active elements. Manufacturing Location: TSMC Fab14 (Taiwan)/ Crolles(France) Current die revision: - STM32F209 1MB rev2 (Cut 2.4) in ST Crolles CRL300 (France) - STM32F209 1MB rev3 (Cut 2.5) in TSMC Fab14 (Taiwan) Current RM0033 Rev 8 - Reference Manual STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced Arm-based 32-bit MCUs New die revision to improve manufacturing efficiency: - STM32F209 1MB rev5 (Cut 2.6) in ST Crolles CRL300 (France) - STM32F209 1MB rev4 (Cut 2.6) in TSMC Fab14 (Taiwan) New RM0033 Rev 9 - Reference Manual - february 2021 STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced Arm-based 32-bit MCUs Timing / schedule Date of qualification results 2021-05-14 Intended start of delivery 2021-12-20
2022/03/31	PCN(Product Change Notice)	Wire Bond Method/Material Change Description of change Old: ASE Kaohsiung back-end: - Gold wire bonding assembly line New: ASE Kaohsiung back-end :- Gold wire bonding assembly line - New Copper Palladium added assembly line Intended start of delivery 2022-03-31
2022/05/08	PCN(Product Change Notice)	NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08
2023/08/28	PCN(Product Change Notice)	ASE Kaohsiung (Taiwan) - qualification of a second source substrate supplier (SCC - Shennan Circuit Company) for BGA package, size from BGA5x5 to BGA18x18, for listed products Old First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different impacted products. New First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product. Second source supplier SCC for all impacted products. Timing / schedule Intended start of delivery 2023-09-06
2024/10/09	PCN(Product Change Notice)	Description of change Old : Current Wire bonding material: - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) gold and Copper Palladium wire. New : Current Wire bonding material: - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) gold and Copper Palladium wire. New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire Timing / schedule Intended start of delivery 2024-12-16
2025/01/15	PCN(Product Change Notice)	Supplier Notice No.:PCI MDG/24/15095 Title: AMKOR ATP (Philippines) Enhanced traceability with 2D marking for UFBGA7x7 and UFBGA10x10 listed products ? (Addendum to PCN14374) Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change Intended start of delivery: 2025-01-15
2025/07/03	PCN(Product Change Notice)	PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3) old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
2025/11/07	PCN(Product Change Notice)	PCN No.: EMBEDDED PROCESSING/25/15422 Description: ASE KaoHsiung (Taiwan) additional source for STM32F74/75xx, STM32F76/77xx listed products in TFBGA 13X13 216L package and STM32F20/21xx, STM32F40/41xx, STM32F42/43xx listed products in UFBGA 10X10 176+25 package.
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

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PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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PCN/PDN/NRND Information

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