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THPM4301A  
THine Electronics   DC to DC Converter and Switching Regulator Chip  -  Product Details

Images are for reference only

  • Added to bookmarks.
  • ECCN:EAR99
  • HTSN:8542900000
  • Lifecycle Status:Active
  • RoHS2
  • PB free
Type
Module DC/DC Converter
Package
LGA-56 9.1X11X2.8mm
Output voltage
0.6 to 3.6V
Input voltage
2.95 to 6V
Output voltage accuracy
1%
Output current
0 to 6A
Operating temperature range
-40 to 85C
Manufacturer Packaging
Tape & Reel
    "Our Intelligence Inductor Power Module offers significant benefits in high density Point of Load modules and represents the next step in POL integration.

    <Suitable for>
    ASIC, ASSP, FPGA, DSP, DDR

    <Features>
    1. High Efficiency - Inductor-based package allows very low DCR, reduced losses

    Compared to conventional packaging technologies, “this inductor technology” reduces constraints on the inductor size. This allows for larger gauge wire and coil diameters to be used within the inductor structure which results in lower power losses and a high efficiency module.

    2. High Power Density - Solutions require minimal board space
    The small size and very low profile (3 mm) package reduces board space, allowing higher density designs.

    3. Cooler Operating Temp. - Packaged in high thermal conductivity magnetic material
    The inductor body acts as a heat sink to evenly sistribute heat, produced by the IC and inductor, across the package and dissipate it to the ambient air. The measured surface temperature is reduced by up to 11.5℃ compared to a module with an internal inductor under identical conditions. High thermal conductivity avoids “hot spots”.

    4. Low Radiated EMI - Core material provides electro-Magnetic shielding
    The inductor material is conductive and acts as a shield over the internal components. All internal power traces are very short, minimizing the loop area and further reducing radiated EMI.

    We have the other line-ups upon Vout/Iout."