| 2020/09/15 |
|
PCN(Product Change Notice)
|
Update to PB22409X : Update to PB22409X:Cancellation of D2PAK Case Outline Standardization from 418B:04 to 418AJ for all effected devices manufactured in On Semiconductor Seremban, On Semiconductor Vietnam and TFME facility. Description and Purpose: This is an Update Notification announces the cancellation of the announcement made in PB22409X. Due to current condition, ON Semiconductor decided not to pursue the change. As a result of this announcement, the case outline will remain as it is (418B?04). There are no product material changes as a result of this change. There is no product marking change as a result of this change. |
| 2023/06/01 |
|
PCN(Product Change Notice)
|
D2PAK Assembly and Test Qualification to Suzhou Goodark Co. Ltd., China for Capacity Expansion.
Proposed First Ship date: 01 Jun 2023 |
| 2023/10/16 |
|
PCN(Product Change Notice)
|
This Final Notification announces to customers the qualification of new assembly and test site of D2PAK packaged products to Good-Ark, China for capacity expansion.
Proposed First Ship date: 29 Jan 2024 |
| 2023/10/21 |
|
PCN(Product Change Notice)
|
This Final Notification announces to customers the qualification of new~assembly and test site of D2PAK packaged products to Good-Ark, China for~capacity expansion. |