PCN/PDN/NRND Information LMC555CMX/NOPB｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN (제품/프로세스 변경 통지) 및 PDN (제품 단종 통지) 정보입니다.

통지일	통지 종류	통지 정보
2024/02/26	PCN (제품 변경 통지)	Texas Instruments is pleased to announce the qualification of its RFAB fabrication facility as an additional Wafer Fab option in addition to an Assembly site/BOM option Proposed 1st Ship Date: May 21, 2024
2024/06/06	PCN (제품 변경 통지)	Supplier Notice No.:20240306005.1 Title: Datasheet for LMC555 Change Notification Description of Change: Texas Instruments Incorporated is announcing an information only notification. The product datasheet(s) is being updated as summarized below. These changes may be reviewed at the datasheet links provided. http://www.ti.com/product/LMC555 Reason for Change: This particular PCN is related to TI’s multiyear transition plan for our two remaining factories with 150-millimeter production (DFAB in Dallas, Texas, and SFAB in Sherman, Texas). Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): Electrical specification performance changes as indicated above. Proposed 1st Ship Date: June 6, 2024
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Reel Processing
It is a service that connects empty tape to both ends of a tape cut using a special tool, set the reel, and rewind it into the packaged form for delivery. It is made so that it can be set as is to a mounting machine. Processing is available from 100 pieces or more.
PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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Package type▼: Bulk:
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