| 2023/03/01 |
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PCN(Product Change Notice)
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MCU/SOC products announcement of Full Carton |
| 2023/03/01 |
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PCN(Product Change Notice)
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MCU/SOC products announcement of Full Carton |
| 2023/05/25 |
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PCN(Product Change Notice)
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Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Change Implementation: 1.Mar. 2023 25.May. 2023 (items in red on page 11) updated |
| 2023/05/29 |
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PCN(Product Change Notice)
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Full cartonization of MCU/SoC products Change of order type name due to change in packaging style |
| 2025/03/01 |
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PCN(Product Change Notice)
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Supplier Notice No.: Title: Notice of Change of Die-Bond Material for RA, SYNERGY and RX Surface-Mount Package Productsa
Description of Change: The back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (“Suzhou”). Changes: The die-bond material will be changed. The new die-bond material is a proven one for mass production at “Suzhou”.
Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Impact on Fit, Form, Function, Quality & Reliability: This change will not affect fitting, form, function, quality, and reliability.
Effective Date: 3/1/2025 |
| 2025/03/01 |
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PCN(Product Change Notice)
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NOTICE OF CHANGE OF DIE-BOND MATERIAL FOR RA, SYNERGY AND RX SURFACE-MOUNT PACKAGE PRODUCTS |