52. General-purpose logic IC fundamental package Suffix table

It is the comparison table of the package code used in the manufacturer’s pattern numbering system of general-purpose logic IC.

Package Manufacturer’s name
Texas Instruments Inc. Toshiba ON Semiconductor Renesas Electronics Fairchild semiconductor IDT

Insertion mounting type

DIP

Dual In-line
Package

N
NT(24pin)

P

P
(AL/Bi-CMOS)
N

P

P
SP(24pin)

P
PT(24pin)

Surface mounting type

SOP
(JEITA -SOP)

Small Outline
Package

NS

F

F
(AL/HS-CMOS)
M

FP

SJ

SOIC
(JEDEC -SOP)

Small Outline
Package

D
DW(20pin or more)

FN
FW(20pin or more)

D
DW(16pin or more)

RP

S
WM(20pin or more)

DC
SO(16pin or more)

SSOP

Shrink Small-Outline Package

DB

FK( 8pin or more)
FS(140 or more)

SD

US(8pin)

MSA

PY

TSSOP

Thin Shrink Small
Outline Package

PW
DGG(48pin or more)

FT

DT

T

MTC
MTD(48/56pin)

PG
PA(48/56pin)