PCN10-32P-2.54DSA(72) Hirose Electric Board-to-board connector - 商品詳細情報
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PCN10-32P-2.54DSA(72)
PCN10-32P-2.54DSA(72)
Conn DIN 41612 HDR 32 POS 2.54mm Solder ST Thru-Hole
HTSN : 8536694040
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Conn DIN 41612 HDR 32 POS 2.54mm Solder ST Thru-Hole
HTSN : 8536694040
| Data Sheet | |
|---|---|
| Datasheet | EN_Hirose Electric_Datasheet_20240308215740856 |
Specifications
- Manufacturer name
- Hirose Electric
- Product name
- PCN10-32P-2.54DSA(72)
- Product classification
- Board-to-board connector
- Lifecycle Status
- Active
- RoHS
- RoHS
- Pitch
- 2.54mm
- Series name
- PCN10
- Product type
- Wire to Board
- Shape/Type
- Straight/DIP
- Number of poles
- 32
- Number of arrays
- 2
- Rated current
- 2A
- Mating height
- 16.8mm
- Contact point finish
- Gold
- Contact resistance
- 20Ohm
- Height
- 11.6mm
- Housing material
- Polybutylene Terephthalate
- Insulation resistance
- 1000GOhm/100VDC
- Length
- 58.54mm
- Maximum service temperature
- 85C
- Minimum service temperature
- -55C
- Other names
- H11164 | *PCN10-32P-2.54DSA(72) | 583-0007-8-72 | PCN1032P254DSA72
- Rated Voltage(AC)
- 300V
- Standard
- IEC|DIN
- Width
- 8.6mm
- Wire connection method
- ラッピング・insulation displacement contact ・ pressure bonding
- Withstanding Voltage
- 1000V
- Cable assembly
- No
- Category
- Board-to-Board
- Connector Type
- Header|Male Pin
- Contact Finish Thickness
- 0.203um
- Contact pitch
- 2.54mm
- Contact plating
- Gold
- Feature
- -
- Form
- B
- Housing Color
- Gray
- Mass
- 5.75g
- Mating/Unmating cycles
- 500
- Mounting Type
- Through Hole
- Number of Levels
- -
- Number of Positions Loaded
- All
- Number of positions
- 32
- Orientation
- Straight
- SVHC
- 27th Not including
- Safety standard
- UL
- Shape of the connector 1
- Header
- Solder wicking prevention
- No
- Terminal
- Solder
- Type
- Straight
- ZIF/Non-ZIF
- Non-ZIF
- Manufacturer Packaging
- Bag(Bulk)
- Manufacturer packaging quantity
- 30
If you find an error in the product information, please let us know here.
Details
* Documents
1. Catalogue
2. 2D model
3. 3D [IGES] model
4. 3D [STEP] model
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