| 2025/10/01 |
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PCN(Product Change Notice)
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There was a mistake in the applicable model, so we would like to inform you again. Changes The die bond adhesive used to bond and fix the housing and sensor chip will be changed.
[Before change (current situation)] Silicon-based adhesive Epoxy-based adhesive [After change] Silicon-based adhesive (new)
*Currently, different adhesives are used for different pressure ranges, but after the change, they will be integrated into the same adhesive.
Change period: Planned to switch gradually from October 2025 production
Applicable models P-2000 and PA-400, PS30, PG-30, PG-100N, PG-200 (excluding absolute pressure type) series
*The PA-400, PS30, PG-30, PG-100N, and PG-200 series use the pressure sensor P-2000, so they are subject to the change.
[Changes] ① Absolute pressure type of PG-200 is not affected ② PA-400 is also affected |