| 2024/10/22 |
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PCN(Product Change Notice)
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Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.
Estimated First Ship Date:November 10, 2024 (date code: 2446) |
| 2025/09/01 |
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PCN(Product Change Notice)
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PCN No. MAAN-13GMCS194 Change Desc. Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.
Estimated Qualification Completion Date: September 2025
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| 2025/09/01 |
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PCN(Product Change Notice)
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PCN No. DSNO-07AOWZ935 Change Desc. Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites. Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Estimated Qualification Completion Date: September 2025 |
| 2025/09/23 |
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PCN(Product Change Notice)
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PDN No.: ALAN-23NWPP173 Description: CCB 7348.001 Final Notice: Qualification?of?palladium coated copper with gold flash (CuPdAu) as a new wire material?for?selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L?SOT-23 package at MTAI assembly?site. |
| 2025/11/28 |
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PCN(Product Change Notice)
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PDN No.: MAAN-16HABX699 Description: CCB 7364.013 Final Notice: Qualification?of?Microchip?Technology Gresham ? Fab 4 (GRTM) as a new fabrication location?for?selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages. |