| 2021/09/14 |
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PCN(Product Change Notice)
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Current Fab Site> SFAB : Process = JI1 / WaferDiameter = 150 mm New Fab Site> CFAB : Process = JI3 / WaferDiameter = 200 mm |
| 2025/03/05 |
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PCN(Product Change Notice)
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Supplier Notice No.:20250225006.0 Title: Datasheet for LM393B, LM2903B, LM193, LM293, LM393 and LM2903
Description of Change: Texas Instruments Incorporated is announcing an information only notification. The product datasheet(s) is being updated.
The datasheet number will be changing. Device Family: LM393B, LM2903B, LM193,LM293, LM393 and LM2903 Change From: / Change To: SLCS005AF / SLCS005AG These changes may be reviewed at the datasheet links provided. http://www.ti.com/product/LM393B
Reason for Change: To accurately reflect device characteristics.
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): No anticipated impact. |
| 2025/03/09 |
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PCN(Product Change Notice)
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The product datasheet(s) is being updated as summarized below. |
| 2025/08/17 |
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PCN(Product Change Notice)
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Supplier Notice No.:20250514003.1 Title:Qualification of RFAB using qualified Process Technology, Die Revision and Datasheet update for select devices
Description of Change: Texas Instruments is pleased to announce the addition of RFAB using the TIB qualified process technology and a die revision change for the devices listed below.
Current Fab Site Additional Fab Site Current Fab / Site / Process Wafer Diameter CFAB / JI3 / 200 mm Additional Fab / Site / Process Wafer Diameter RFAB / TIB / 300 mm
Reason for Change: Continuity of Supply
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive /negative): None
Proposed 1st Ship Date: August 17, 2025 |