Chip One Stop - Shopping Site for Electronic Components and Semiconductors
Menu
India
Change
English
SELECT YOUR LANGUAGE
USD
SELECT YOUR CURRENCY FOR DISPLAY
About Preferential Rank / Discount

Current price of Item(s) have been applied below.
 


・Preferential Rank and Discount rate will be applied according to your usage of our web service.
・Discount is only applicable to orders from chip1stop web site.
・Discounts may not be applicable to all products and may be subject to MOQ.
・Please contact your representative for details of Preferential Rank.
・No other coupons may be used in conjunction with this discount.

PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2021/09/14 PCN(Product Change Notice) Current Fab Site> SFAB : Process = JI1 / WaferDiameter = 150 mm
New Fab Site> CFAB : Process = JI3 / WaferDiameter = 200 mm
2025/03/05 PCN(Product Change Notice) Supplier Notice No.:20250225006.0
Title:
Datasheet for LM393B, LM2903B, LM193, LM293, LM393 and LM2903

Description of Change:
Texas Instruments Incorporated is announcing an information only notification.
The product datasheet(s) is being updated.

The datasheet number will be changing.
Device Family:
LM393B, LM2903B, LM193,LM293, LM393 and LM2903
Change From: / Change To:
SLCS005AF / SLCS005AG
These changes may be reviewed at the datasheet links provided.
http://www.ti.com/product/LM393B

Reason for Change:
To accurately reflect device characteristics.

Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
No anticipated impact.
2025/03/09 PCN(Product Change Notice) The product datasheet(s) is being updated as summarized below.
2025/08/17 PCN(Product Change Notice) Supplier Notice No.:20250514003.1
Title:Qualification of RFAB using qualified Process Technology, Die Revision and Datasheet update for select devices

Description of Change:
Texas Instruments is pleased to announce the addition of RFAB using the TIB qualified
process technology and a die revision change for the devices listed below.

Current Fab Site Additional Fab Site
Current Fab / Site / Process Wafer Diameter
CFAB / JI3 / 200 mm
Additional Fab / Site / Process Wafer Diameter
RFAB / TIB / 300 mm

Reason for Change:
Continuity of Supply

Anticipated impact on Form, Fit, Function, Quality or Reliability (positive /negative):
None

Proposed 1st Ship Date:
August 17, 2025
Click here for contact regarding final purchasing
PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Product & Sales Information of products subject to notification

   123  Last  NEXT
Products: 68 out of cases/Show 1 to 25






   123  Last  NEXT
Products: 68 out of cases/Show 1 to 25