| 2023/07/07 |
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PCN(Product Change Notice)
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Revision of Package Outline Drawing (POD) for LFCSP, particularly on the flange~(A3 feature) to include 0.3mm flange thickness as additional option to the~0.2mm flange thickness. Data Sheet revision. |
| 2023/09/28 |
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PCN(Product Change Notice)
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Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor Effectivity Date: 28-Sep-2023 (the earliest date that a customer could expect to receive changed material) |
| 2024/02/08 |
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PCN(Product Change Notice)
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Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor Revision Description: 1) Update Package Outline Drawing List Attachment and Device list. 2) Removed parts. AD9239BCPZ-170 AD9239BCPZ-250 AD9639BCPZ-170 AD9639BCPZRL-170 AD9780BCPZ AD9780BCPZRL AD9781BCPZ AD9781BCPZRL AD9783BCPZ AD9783BCPZRL |
| 2025/12/18 |
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PCN(Product Change Notice)
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PCN No. PCN 24_0009 Rev. F Change Desc. Revision Description: Add parts. Analog Device is adding Analog Devices Beaverton OR, USA (ADBN) as an alternate Wafer Fab site to TSMC Taiwan for 0.18um Mixed Signal CMOS Process. |