PCN/PDN/NRND Information IXGH28N60B3D1｜shopping sight of electronic components and semiconductor- chip one stop

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PCN/PDN/NRND 정보

PCN (제품/프로세스 변경 통지) 및 PDN (제품 단종 통지) 정보입니다.

통지일	통지 종류	통지 정보
2024/08/15	PCN (제품 변경 통지)	Supplier Notice No.:LFPCN-DMI-BTA-2024-00101 Title: Product Change Notification for Littelfuse Discrete MOSFETs & IGBTs DESCRIPTION OF CHANGE: 1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-247-3L, TO-247HV, PLUS247, PLUS TO-247HV (PLUS247HV), ISO247 and ISOPLUS247 packages. This will further streamline and enhance our supply chain efficiencies. Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers. The change will be implemented by 15th August 2024 if there is no further concern and feedback.
2024/08/15	PCN (제품 변경 통지)	Supplier Notice No.:LFPCN-DMI-BTA-2024-001/01 Title: Product Change Notification for Littelfuse Discrete MOSFETs & IGBTs DESCRIPTION OF CHANGE: 1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-247-3L, TO-247HV, PLUS247, PLUS TO-247HV (PLUS247HV), ISO247 and ISOPLUS247 packages. This will further streamline and enhance our supply chain efficiencies. 2. Change in device marking 3. Change in inner box and tube labels, and tube dimensions Form, fit, function changes: No The change will be implemented by 15th August 2024 if there is no further concern and feedback.
2024/10/21	PCN (제품 변경 통지)	The ENEC marking for some switch product series will be removed due to duplication with existing UL certification.
2025/02/26	PCN (제품 변경 통지)	We will be adding a new alternative epoxy molding compound (EMC) to the back-end manufacturing of some discrete MOSFETs, IGBTs, multi-chip, and bipolar products. #: LFPCN-DMI-BTA-2024-003/01
2025/02/26	PCN (제품 변경 통지)	Supplier Notice No.:LFPCN-DMI-BTA-2024-00301 Title: Product Change Notification for Littelfuse MOSFET, IGBT, Multichip and Power Bipolar Discrete Devices DESCRIPTION OF CHANGE: Addition of new alternative epoxy molding compound for discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative epoxy molding compound has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B. Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers Affected parts shipped from February 26, 2025, will only be with the new EMC.
2025/02/26	PCN (제품 변경 통지)	Supplier Noatice No.:LFPCN-DMI-BTA-2024-00302 Title: Littelfuse has qualified an alternative epoxy molding compound (EMC), free of dechlorane plus,(Discrete IGBTs) DESCRIPTION OF CHANGE: Qualification of the new alternative EMC, free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative EMC has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B. Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers. Affected parts shipped from February 26, 2025, will only be with the new EMC, free of dechlorane plus.
2025/10/01	PCN (제품 변경 통지)	PCN No.:LFPCN-DMI-BTA-2024-001/02 Change Desc.:This PCN is a revised version of the previously issued PCN LFPCN-DMI-BTA-2024-001/01, dated May 13, 2024, which informed you of an additional backend manufacturing site for the discrete MOSFET and IGBT parts. -----For your Reference -(LFPCN-DMI-BTA-2024-001/01)---- Supplier Notice No.:LFPCN-DMI-BTA-2024-001/01 Title: Product Change Notification for Littelfuse Discrete MOSFETs & IGBTs DESCRIPTION OF CHANGE: 1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-247-3L, TO-247HV, PLUS247, PLUS TO-247HV (PLUS247HV), ISO247 and ISOPLUS247 packages. This will further streamline and enhance our supply chain efficiencies. 2. Change in device marking 3. Change in inner box and tube labels, and tube dimensions Form, fit, function changes: No The change will be implemented by 15th August 2024 if there is no further concern and feedback.
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PCN/PDN Information
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