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PCN/PDN/NRND信息

PCN(产品/工艺变更通知)和PDN(生产中断通知)信息。

通知日期 通知文书 通知类型 通知信息
2021/06/27 PCN(产品规格变更通知) Amkor Philippines as an alternate assembly site for SOICN.
Adding Amkor Philippines as an alternate site to ensure continuous supply in order to meet volume requirements.
2021/07/24 PCN(产品规格变更通知) Revised PCN Alert: Amkor Philippines as an Alternate Site for SOICN has been revised.
Remove parts with die coat.
Update material set change matrix
2021/11/12 PCN(产品规格变更通知) Amkor Philippines as an Alternate Site for SOICN
Publication Date: 10-Aug-2021
Effectivity Date: 12-Nov-2021
Description Of Change:
ADI will be utilizing Amkor Philippines as an alternate assembly site for SOICN.
2025/10/03 PCN(产品规格变更通知) PCN No.:PCN 25_0162 Rev. -
Change Desc.:Gold to Copper Wire Conversion
Change of bond wire from Gold wire to Copper wire for all the parts listed, in specific subcon. BOM also updated to be compatible with Cu
wire.
ASECL: BOM compound G700LA and Die attach EN4900G.
ATP: compound is Sumitomo G700LS and Die attach AB8290.
UTAC: compound is G700LTD and Die attach AB8600.
All materials have qualified and in production for ADI devices.

Reason For Change:
The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives.
Note: ASE, Amkor, UTAC, all have been in Cu wire production for 10+ years and over billion units shipped to commercial and automotive
customers.

Effectivity Date:
03-Oct-2025 (the earliest date that a customer could expect to receive changed material)
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