| 2023/02/01 |
|
PCN（产品规格变更通知）
|
Labeling Change
DESCRIPTION OF CHANGE:
Change to the assembled device marking format
The change affects the date code and tracking number identification.
This change does not affect the form, fit or function of the product. |
| 2023/02/13 |
|
PCN（产品规格变更通知）
|
Product Change Notification for Littelfuse
MOSFET DISCRETE, IGBT DISCRETE over 650V in TO-247 package adding new manufacturing location
We would like to notify you of the differences between the existing manufacture and the new manufacture.
1. POD ? Package Outline Dimension
2. Package Marking
3. BOM
4. Label |
| 2023/02/13 |
|
PCN（产品规格变更通知）
|
Littelfuse would like to notify you of a change related to the TO-247 package for over 650V.
DESCRIPTION OF CHANGE:
As a part of Littelfuse endeavors to improve the manufacturing footprint and to enhance capacity,
it has been decided to introduce a new TO-247 backend manufacturing in China. |
| 2023/02/14 |
|
PCN（产品规格变更通知）
|
MOSFET DISCRETE, IGBT DISCRETE over 650V in TO-247 package adding new manufacturing location
As a part of Littelfuse endeavors to improve the manufacturing footprint and to enhance capacity,
it has been decided to introduce a new TO-247 backend manufacturing ATXWH in China. |
| 2024/10/21 |
|
PCN（产品规格变更通知）
|
The ENEC marking for some switch product series will be removed due to duplication with existing UL certification. |
| 2025/02/26 |
|
PCN（产品规格变更通知）
|
We will be adding a new alternative epoxy molding compound (EMC) to the back-end manufacturing
of some discrete MOSFETs, IGBTs, multi-chip, and bipolar products.
#: LFPCN-DMI-BTA-2024-003/01
|
| 2025/02/26 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:LFPCN-DMI-BTA-2024-00301
Title:
Product Change Notification for Littelfuse MOSFET, IGBT, Multichip and Power Bipolar Discrete Devices
DESCRIPTION OF CHANGE:
Addition of new alternative epoxy molding compound for discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP).
The new alternative epoxy molding compound has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
Form, fit, function changes:
Littelfuse does not anticipate any change in form/fit/function of the affected part numbers
Affected parts shipped from February 26, 2025, will only be with the new EMC.
|
| 2025/02/26 |
|
PCN（产品规格变更通知）
|
Supplier Noatice No.:LFPCN-DMI-BTA-2024-00302
Title:
Littelfuse has qualified an alternative epoxy molding compound (EMC), free of dechlorane plus,(Discrete IGBTs)
DESCRIPTION OF CHANGE:
Qualification of the new alternative EMC, free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP).
The new alternative EMC has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
Form, fit, function changes:
Littelfuse does not anticipate any change in form/fit/function of the affected part numbers.
Affected parts shipped from February 26, 2025, will only be with the new EMC, free of dechlorane plus. |
