| 2023/03/01 |
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PCN(产品规格变更通知)
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MCU/SOC products announcement of Full Carton |
| 2023/03/01 |
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PCN(产品规格变更通知)
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MCU/SOC products announcement of Full Carton |
| 2023/05/25 |
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PCN(产品规格变更通知)
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Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Change Implementation: 1.Mar. 2023 25.May. 2023 (items in red on page 11) updated |
| 2023/05/29 |
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PCN(产品规格变更通知)
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Full cartonization of MCU/SoC products Change of order type name due to change in packaging style |
| 2025/10/01 |
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PCN(产品规格变更通知)
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PDN No.: EPO-EX-25-0153 Description: Notice of Change in Wire and Materials for RX630/631/63N Group LFBGA Package products |
| 2025/10/01 |
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PCN(产品规格变更通知)
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PDN No.: EPO-EX-25-0153-2 Description: Notice of Change in Wire and Materials for RX630/631/63N Group LFBGA Package products : Revision 1Replacement of Appendix 3.Reliability Test Results |