| 2020/09/08 |
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PCN(产品规格变更通知)
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PRODUCT CHANGE NOTIFICATION |
| 2020/09/09 |
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PCN(产品规格变更通知)
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PRODUCT CHANGE NOTIFICATION |
| 2020/10/01 |
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PCN(产品规格变更通知)
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MCU/SOC (GP products) announcement of Full carton |
| 2021/04/01 |
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PCN(产品规格变更通知)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing change from Fractional Tray to Full Carton : Shipments from REA of devices in Full Cartons begins. October 1, 2020 |
| 2021/04/01 |
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PCN(产品规格变更通知)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing form with a tray from fraction to Full Carton (full packing) : Full Carton shipment will become standard, combining max. 3 lot codes worst case |
| 2023/06/09 |
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PCN(产品规格变更通知)
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Notice of material change for RX Family LFQFP/LQFP products Change the die bond and resin material. The changed material will be a material that has a proven track record in RSB assembly.
Estimated shipping date: 10/1/2023 |
| 2023/10/01 |
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PCN(产品规格变更通知)
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Description of Change: Die-bonding and resin materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd). The new materials are already proven and used for other products in RSB assembly. No samples planned because the changed materials are already well known and used in mass production for other products.
Schedules: Change Implementation: b/o Oct. 2023 onwards
# Due to the large number of products covered by this notice, we have divided the notices. |
| 2024/11/01 |
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PCN(产品规格变更通知)
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Addition of frontend production site for RX111, RX113, RX130, RX230, RX231 group |
| 2024/11/01 |
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PCN(产品规格变更通知)
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Addition of Wafer fabrication site: Renesas Semiconductor Manufacturing Co., Ltd. (Naka Factory) |