| 2023/04/01 |
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PCN(产品规格变更通知)
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Wafer Size Change Now: *On-board SiC chip's wafer diameter: 4inch - Front-end manufacturing plants : - ROHM Apollo Co., Ltd. Chikugo Plant After: *On-board SiC chip's wafer diameter: 6inch - Front-end manufacturing plants : - Lapis Semiconductor Co., Ltd. Miyazaki Plant Planned first ship date : April, 1,2023 |