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  2. PCN/PDN/NRND信息

PCN/PDN/NRND信息

PCN（产品/工艺变更通知）和PDN（生产中断通知）信息。

通知日期 通知文书 通知类型 通知信息
2021/01/08 PCN（产品规格变更通知） PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2021/03/11 PCN（产品规格变更通知） AMKOR ATP (Philippines) enhanced Die Attach (new material) - All listed product in UFBGA package
2021/06/15 PCN（产品规格变更通知） Old> marking composition with no SS marking
New> marking composition with additional SS marking
2022/03/31 PCN（产品规格变更通知） Wire Bond Method/Material Change
Description of change
Old: ASE Kaohsiung back-end: - Gold wire bonding assembly line
New: ASE Kaohsiung back-end :- Gold wire bonding assembly line
- New Copper Palladium added assembly line
Intended start of delivery 2022-03-31
2022/05/08 PCN（产品规格变更通知） NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2024/10/09 PCN（产品规格变更通知） Description of change
Old : Current Wire bonding material:
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) gold and Copper Palladium wire.
New : Current Wire bonding material:
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) gold and Copper Palladium wire.
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire

Timing / schedule Intended start of delivery 2024-12-16
2025/01/15 PCN（产品规格变更通知） Supplier Notice No.:PCI MDG/24/15095
Title:
AMKOR ATP (Philippines) Enhanced traceability with 2D marking for UFBGA7x7 and UFBGA10x10 listed products ? (Addendum to PCN14374)

Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly

Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change

Intended start of delivery:
2025-01-15
2025/07/03 PCN（产品规格变更通知） PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(2/3)

old/
Marking composition with no 2D marking

New/
New marking composition with 2D marking for
production assembly
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