| 2021/01/08 |
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PCN(产品规格变更通知)
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MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
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| 2022/05/08 |
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PCN(产品规格变更通知)
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Notification related for 2nd EMEA DC project in Frankfurt NEW DISTRIBUTION CENTER Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/05/08 |
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PCN(产品规格变更通知)
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Notification related for 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2024/02/26 |
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PCN(产品规格变更通知)
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Description of change Old: Manufacturing Organization: R2 and AG8-AGM New: Manufacturing Organization: AG200
Timing / schedule Intended start of delivery 2024-02-29 |
| 2026/05/29 |
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PCN(产品规格变更通知)
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Supplier Notice No.:CRP/25/15383 Title:(1/4)ST manufacturing reshaping program - Corporate PCI - Early Notification
Description of change: Old/ST manufacturing landscape New/Reshaping of ST’s manufacturing footprint by end 2027
Anticipated Impact on form,fit,function, quality, reliability or processability? Form : no impact Fit : no impact Function : no impact Reliability : no impact Processability : no impact
Intended start of delivery: 2026-05-29 |
| 2027/06/15 |
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PCN(产品规格变更通知)
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PCN No.:ANALOG MEMS SENSORS/25/15685 Change Desc.:ST Manufacturing Reshaping (Analog_FE+EWS BCD5_AG200toSG8E_all): Qualification of SG8E (Singapore) as new FE location and SGP plant (Singapore) as new EWS Location for BCD5 products Intended start of delivery: 2027-06-15 |