| 2021/12/20 |
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PCN(产品规格变更通知)
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Texas Instruments Incorporated is announcing the qualification of additional Assembly sites |
| 2021/12/20 |
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PCN(产品规格变更通知)
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Qualify additional Assembly sites for select SOT devices
SOT-23 (DBV) Assembly Sites: TIPI, ASEWH, HFTF, HNA, TFME, TIEM, CDAT Lead Finish: NiPdAu; NiPdAuAg; Matte Sn Mount compound: 400180; A-03; 4213245; 400194; 4207123 Mold Compound: R-27; 8097131; R-13, 450413; R-04, 450042; 4222198
Proposed 1st Ship: Dec 20, 2021 |
| 2021/12/20 |
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PCN(产品规格变更通知)
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TEXAS INSTRUMENTS Revised PCN/PDN information The target product has been added. [Initial notification content] For the target products, add CDATE and TIME to the post-processing factory. Expected effective date: December 20, 2021 |
| 2023/08/31 |
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PCN(产品规格变更通知)
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Revision B is to remove devices in the Product Affected Section. This device will continue to be manufactured as prior and will not be subjected to the change described in this notification. |
| 2024/02/06 |
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PCN(产品规格变更通知)
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Supplier Notice No.:20240203000.0 Title: Pin one Device symbolization update for Select SOT Devices
Description of Change: Texas Instruments Incorporated is announcing an update to the pin one designator on select SOT devices as follows: Current:Pin One Stripe only Proposed:Pin One Stripe or Pin one Dot Following this notification, devices can be shipped with either the pin one stripe or the pin 1 dot.
Reason for Change: Improved internal traceability
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): Device marking change only |
| 2024/07/03 |
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PCN(产品规格变更通知)
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Texas Instruments is pleased to announce the qualification of its RFAB fabrication facility as an additional Wafer Fab option in addition to Assembly site/BOM options
Proposed 1st Ship Date: September 26, 2024 |