PCN/PDN/NRND Information CY7C65620-56LTXC｜shopping sight of electronic components and semiconductor- chip one stop

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2020/07/27	PCN(Product Change Notice)	USB Products Failure Analysis Policy Change Cypress is changing its policy for failure analysis of USB products to only accept units for failure analysis if the customer has successfully completed an ABA swap test1 for non-WLCSP/BGA packages or chip isolation test for WLCSP/BGA packages to confirm the failure was caused by the Cypress device. Additional information to replicate and solve the customer issue in a timely manner will be required.
2021/07/05	PCN(Product Change Notice)	Minimum Order Quantity, Packing and Shipping Configuration Standardization for Non-Memory Products These changes will be implemented immediately at all Cypress in-house and qualified subcontractor locations. Please be advised that starting July 5, 2021, all new orders must follow these new Minimum Order Quantity (MOQ)/Order Increment (OI)
2023/12/26	PCN(Product Change Notice)	Supplier Notice No.:052/23 Title: Label change affecting dedicated Legacy Cypress products Reason: Change of label size (with no impact on bar code) to align Legacy Cypress with IFX label size. Description: Old:? Size: 100mm x 63mm New:? Size: 105mm x 51mm Impact of change: No impact on product form, fit, function Intended start of delivery: 2023-12-26
2023/12/26	PCN(Product Change Notice)	Supplier Notice No.:052/23 Title: Label change affecting dedicated Legacy Cypress products Reason: Change of label size (with no impact on bar code) to align Legacy Cypress with IFX label size. Description: Old:? Size: 100mm x 63mm New:? Size: 105mm x 51mm Impact of change: No impact on product form, fit, function Intended start of delivery: 2023-12-26
2024/09/12	PDN(Product Discontinuation Notice)	Supplier Notice No.:PD_314_24 Title: Product discontinuation Reason: No fabrication support from SkyWater (Fab) and there is no alternative to manufacture. Therefore, products will be discontinued.
2025/02/25	PCN(Product Change Notice)	Supplier Notice No.:098/24 Title: Change of label affecting dedicated products: addition of HAL-free mark Description: Old/ - Label without HAL-free mark New/ - Label with HAL-free mark Reason: Standardization of labelling for Infineon products. Deeper integration of supply chain and detailed assessment confirmed HAL-free products in Infineon portfolio. Impact of change: No impact on electrical performance of the products as only the labelling on the product packing will reflect the change. Intended start of delivery: 2025-02-25
2025/03/15	PDN(Product Discontinuation Notice)	PDN No.: PD_314_24A Description: Original Product Discontinuation No PD_314_24 (dated 2024-09-12) Update : LDD is extended 2025-09-15 > 2025-12-15
2025/03/15	PDN(Product Discontinuation Notice)	PDN No. PD_314_24B Change Desc. - updated information - Last delivery date: 2025-12-31 >> 2026-03-31
2025/04/15	PCN(Product Change Notice)	Supplier Notice No.: Title: Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products from Infineon Technologies Manufacturing Ltd. Philippines Branch Description: Old/ -Kyocera KEG 3000NASLS/KEG3000DACY New/ - Sumitomo EME G600CE - Kyocera KEG 3000NASLS/KEG3000DACY Reason: Experienced inconsistency delivery support from existing mold compound supplier - Kyocera. Intended start of delivery: 2025-04-15
2026/06/30	PCN(Product Change Notice)	PDN No.: N2024-164-C Description: Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products from Infineon Technologies Manufacturing Ltd. Philippines Branch. (Original PCN N 2024-164-A dated 2024-11-07 : C1S ) - Update of First sample availability data from 2025-02-28 to 2026-03-31. Update of the Intended start of delivery from 2025-04-15 to 2026-06-30.
2026/06/30	PCN(Product Change Notice)	PCN No.:2024-164-C Change Desc.:Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products from Infineon Technologies Manufacturing Ltd. Philippines Branch. Reason: Experienced inconsistency delivery support from existing mold compound supplier - Kyocera. To enable sourcing flexibility and mitigate supply risk, Sumitomo is introduced as an additional mold compound supplier. Intended start of delivery : 2026-06-30
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

Shopping Guide

Products in stock are shipped any time after payment is completed.
If you need a quotation, please print it from your "shopping cart" or "order history".
Products out of stock will have a "Quote" button instead of an "Add to Cart" button. Please request a quotation first.

Payment Method ▼: NET 30 *1 / Credit card *2 / TT in advance / Alipay *3
*1 Application and approval required.
*2 Currently available for orders in JPY, USD, AUD, NZD, and EUR.
*3 Only available in China Mainland and Hong Kong.

Invoice total ▼: Merchandise total + Shipping fee

Shipping fee ▼: Customers are responsible for paying shipping fee and can select from the following methods:
1 Pay fixed cost to Chip One Stop*
2 Bill customer's shipper account number
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Delivery ▼: Ordered products are shipped from our logistic center (in Yokohama, Japan) by a courier designated by the customer. All shipments are F.C.A. point of shipment from Chip One Stop warehouse.
The expected shipment date for back-ordered products is displayed based on the cutoff time for each order. Please check it in the search results.
A shipping notice with a tracking number will be emailed shortly after your shipment leaves Chip One Stop. The tracking number will be also stated on My Page.

About Icons/Product Information

Inventory Information ▼

: JP:Japan, HK:Hong Kong, US:United States
EU:Europe, AUS:Australia, Asia:Asia, NA:North America

Supplier Information ▼

: Sourced from manufacturers and authorized distributors

: Stocks of semiconductor sourced from authorized distributors

Product Information ▼

MOQ/SPQ

MOQ：: Minimum purchase quantity that can be ordered.
Please enter a number greater than the MOQ when ordering.

SPQ：: Number of units that can be ordered.
Please enter a quantity in multiples of the SPQ when ordering.

Reel Processing
It is a service that connects empty tape to both ends of a tape cut using a special tool, set the reel, and rewind it into the packaged form for delivery. It is made so that it can be set as is to a mounting machine. Processing is available from 100 pieces or more.
PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
For details regarding product specification changes or discontinuation, please ensure to check the manufacturer's official website.

Package type▼: Bulk:
Bulk is a package which the separete parts are packed in a bag, or packed individually.
Tape & Reel:
Tape & Reel is the unmodified original reel received from the manufacturer.
In case the MOQ is smaller than the manufacturer's standard package quantity, it will be cut tapes even if the package is shown as "Tape & Reel".
Cut tape:
Cut tape is a tape cut from an original reel. Cut tape does not contain a leader or trailer.
If you require a one continuous cut tape, please put your comment on your remarks.
For our supplier's stock, we are unable to ensure that the package will be one continuous cut tape even if you put your remark.

RoHS information ▼

: RoHS 2011/65/EU amended by 2015/863 Compliant

Product Information ▼

: New Products released by manufacturers within 1 year

: New Products on Chip One Stop website within 3 months

Bulk Search Function

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PCN/PDN/NRND Information

Product & Sales Information of products subject to notification