| 2021/08/26 |
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PCN(Product Change Notice)
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Scheduled changes affect ESD protection devices in SOT23. These include: - bond wire material wil be changed from gold (Au) to copper (Cu). Gold wire remains qualified for supply security reason - for some products, 200mm wafers will be introduced in additional to currently released 150mm wafers - for some products, new die design and back side metallization will be implemented |
| 2021/08/26 |
|
PCN(Product Change Notice)
|
Scheduled changes affect ESD protection devices in SOT23. These include: - bond wire material wil be changed from gold (Au) to copper (Cu). Gold wire remains qualified for supply security reason - for some products, 200mm wafers will be introduced in additional to currently released 150mm wafers - for some products, new die design and back side metallization will be implemented |
| 2024/01/07 |
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PCN(Product Change Notice)
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Introduction of new carrier tape material in SOT23 A new surface material for carrier tapes for the package SOT23 will be introduced as second source: Polystyrene (PS) in addition to Polycarbonate (PC). The cover tape material will remain unchanged.
Since there are many applicable products, this notification is divided into individual notifications. Depending on your company's purchase history, you may receive multiple notifications. Please be aware. |
| 2024/06/15 |
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PCN(Product Change Notice)
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Nexperia changes the finished goods label, this includes: - Readable text~orderable part number (OPN) on SPQ and PQ labels, (34P) - 2D matrix code on SPQ~label, embedded with packing unit identifier (PUID) data - Replace (31D) Redate~by (32D) Date1 for new re-date code definition - QR code on PQ label (for~internal use mainly) * Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same. Our notification number: PP0000735569 / PP0000735597 |