| 2024/10/22 |
|
PCN（产品规格变更通知）
|
Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material
for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx
and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.
Estimated First Ship Date:November 10, 2024 (date code: 2446) |
| 2025/02/11 |
|
PCN（产品规格变更通知）
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Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new
fabrication location for multiple device families available in various packages.
Pre Change : Microchip Technology Tempe ? Fab 2 (TMGR)
Post Change : Microchip Technology Gresham ? Fab 4 (GRTM)
Estimated Qualification Completion Date: July 2025 |
| 2025/04/22 |
|
PCN（产品规格变更通知）
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Description of Change:
Revision D
Following is the list of changes for this revision:
? Added AEC-Q100 Qualification to Features and General Description.
? Added Related Devices.
? Updated the temperature range from industrial (-40°C to +85°C) to extended (-40°C to +125°C)
in Section 1.0, ""Electrical Specifications"".
? Updated Table 1-1, ""DC Electrical Specifications"" notes.
? Updated Product Identification System.
? Added Product Identification System (Automotive).
? Changed terminology:
- Master device → Host device
- Slave device → Client device
? Updated Section 7.1, ""Package Marking Information"".
? Updated package drawings in Section 7.2, ""Package Drawings"".
? Several minor improvements to text formatting, parameter symbols and figures.
? Updated Trademark, Legal Notice and Microchip Devices Code Protection Feature information.
For details, refer to the Microchip Information page.
? Removed Worldwide Sales and Service page.
|
| 2025/09/01 |
|
PCN（产品规格变更通知）
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PCN No. MAAN-13GMCS194
Change Desc.
Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317,
MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x,
MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU,
MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x,
TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.
Estimated Qualification Completion Date: September 2025
|
| 2025/09/01 |
|
PCN（产品规格变更通知）
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PCN No. DSNO-07AOWZ935
Change Desc.
Qualification of CRM-1151GA as new die attach material
for selected various device families available in 5L SOT-23 and 6L SOT-23 packages
at MMT and MTAI assembly sites.
Reason for Change:
To improve manufacturability by qualifying CRM-1151GA as a new die attach to
standardize the use of PFAS-free material.
Estimated Qualification Completion Date: September 2025 |
| 2025/09/23 |
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PCN（产品规格变更通知）
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PDN No.: ALAN-23NWPP173
Description: CCB 7348.001 Final Notice: Qualification?of?palladium coated copper with gold flash (CuPdAu) as a new wire material?for?selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L?SOT-23 package at MTAI assembly?site. |
| 2025/11/14 |
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PCN（产品规格变更通知）
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PCN No.: ALAN-16SLVL366
Description: Final Notification : CCB 7364 Final Notice: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages. (cf. Interim Report : PP0000738356, PP0000738357, PP0000738358) |
