| 2025/07/22 |
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PCN(产品规格变更通知)
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PDN No.: BLAS-25TFGQ302 Description: CCB 7626 Final Notice: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package. |