| 2024/08/01 |
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PCN(产品规格变更通知)
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Additional content Post-process production location (assembly to FT) Current: LAPIS Semiconductor Co., Ltd. (Miyazaki City, Miyazaki Prefecture) After addition: LAPIS Semiconductor Co., Ltd. (Miyazaki City, Miyazaki Prefecture) Ome Electronics Co., Ltd. (Ome City, Tokyo) Additional difference ・Mold resin: Different from the current one. Please note that prohibited substances are not included. ・Cross-sectional structure: The basic structure of placing terminals on the AL pad is the same as the current one, Although there are minor differences, it is not a special structure for WLCSP. ・Terminal composition: (current product) Sn-Ag → (additional product) Sn-3Ag-0.5Cu |