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关于优惠等级和折扣率

目前的商品价格将适用于以下


・根据顾客的购买情况可以享受优惠和折扣
・关于折扣仅限于从本网站直接下单的订单
・部分产品和阶梯数量不被包含在优惠折扣产品中
・关于优惠等级的详细信息请联系您的销售人员
・不能与其它优惠同时使用

PCN/PDN/NRND信息

PCN(产品/工艺变更通知)和PDN(生产中断通知)信息。

通知日期 通知文书 通知类型 通知信息
2021/01/08 PCN(产品规格变更通知) PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2022/05/08 PCN(产品规格变更通知) NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2023/03/21 PCN(产品规格变更通知) ASE KaoHsiung (Taiwan) LQFP 24x24 package copper palladium bonding wire introduction
on STM32F2/F4/F7x and STM32H5/H7x listed products

Timing / schedule Intended start of delivery 2023-03-21
2023/03/21 PCN(产品规格变更通知) ASE LQFP 24X24 package copper palladium bonnding wire introduction
2024/09/02 PCN(产品规格变更通知) Supplier Notice No.:24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products

Description of change:
Old/Marking composition with no 2D marking
New/New marking composition with 2D marking for production assembly

Motivation:
to enhance traceability

Intended start of delivery:
2024-09-02
2025/05/20 PCN(产品规格变更通知) ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x
Description of change

Old Current assembly sites (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
You may refer to 15271_Additional
information.pdf document for further details.

New Current assembly sites: (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
Additional assembly site for extended capacity:
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
2025/09/02 PCN(产品规格变更通知) ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
2025/09/02 PCN(产品规格变更通知) Supplier Notice No.:MDG/24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products

Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly

Motivation:
to enhance traceability

Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change

Intended start of delivery:
2025-09-02
2025/11/04 PCN(产品规格变更通知) Supplier Notice No.:MICROCONTROLLERS/25/15305
Title:ST ROUSSET (France) additional source for STM32F411x , STM32F412x and STM32F76x/F77x listed products in M10/90nm technology.

Type of change:
Line transfer for a full process or process brick(process step, control plan, recipes) from one site to another site: Wafer fabrication (SOP 2617)

Manufacturing Location:
ST Rousset (France)

Anticipated Impact on form,fit, function, quality, reliability or processability?
No change on Form, Fit or Function - same datasheets

Intended start of delivery:
2025-11-04
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