| 2024/06/07 |
|
PCN(产品规格变更通知)
|
Description of change Old: Current PBO process: - PBO1 material: HD8820 - RDL material: Ti / Al / Ti (Sputter), etchant: Phosphoric acid base, HF base - UBM metal: Al/ NiV / Cu (Sputter), etchant: Nitric acid base, Phosphoric acid base New: Purpose CR8 process: - PBO1 material: HD4000E - RDL material: Ti/Cu (Sputter) + Cu (Plate), etchant: (Cu Ti)H2O2 base - UBM metal: Ti/Cu (Sputter) + Cu (Plate), etchant: (Cu Ti)H2O2 base
Timing / schedule Intended start of delivery 2024-08-31 |