| 2024/12/15 |
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PCN(产品规格变更通知)
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Supplier Notice No.:PCN AMS/24/14957 Title: Bump type change from SnPb bumps to SnAg bumps for 101X family
Description of change: Old/PI BCB 5um + SnPb solder (Cu/ Ni/ SnPb) 125um - - Bump : Sputter UBM Ti/ Cu 2kA/ 4kA+ Electroplating UBM Cu/ Ni 5um/ 3um +Electroplating SnPb 117um
New/PI HD4100 5um + SnAg solder (Cu/ Ni/ SnAg) 125um- Bump : Sputter UBM Ti/ Cu 2kA/ 4kA + Electroplating UBM Cu/ Ni 5um/ 3um + Electroplating SnAg 117um
Anticipated Impact on form,fit,function, quality, reliability or processability? No impact
Intended start of delivery: 2024-12-15 |