| 2021/03/21 |
|
PCN(Product Change Notice)
|
Capacity expansion with introduction of an additional assembly and final test location at Huayi Microelectronics Co., Ltd (HYME), China for dedicated TO220 3L MOSFET products in Gen 5.X/7.X/10.X |
| 2022/04/01 |
|
PCN(Product Change Notice)
|
Capacity extension for dedicated Gen10.7 products by introduction of additional wafer manufacturing site at Samsung Electronics Co. Ltd., Korea and Infineon Technologies Dresden,Germany
Time schedule Intended start of delivery 2022-04-01 |
| 2023/12/11 |
|
PCN(Product Change Notice)
|
Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products Reason To ensure continuity of mold compound supply due to Kyocera KEG300 end of life and to further ensure our product performance with lead-free electroplating finish Description Assembly materials:Mold compound Old: Kyocera KEG300 New: Sumitomo EME-E500 Assembly materials:Lead finish (Tijuana only) Old: Tin dip finish New: Lead-free electroplating finish
Intended start of delivery 2024-02-29 |
| 2024/02/29 |
|
PCN(Product Change Notice)
|
Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products |
| 2025/06/10 |
|
PCN(Product Change Notice)
|
PCN No.: 024/25X Description: Updated document, Reason of update:The INF N 024/25, dated 2025-06-04 has been~cancelled. |
| 2025/08/20 |
|
PCN(Product Change Notice)
|
PCN No. 076/25 Change Desc. To reflect the correct Environmental Flags for dedicated products in TO220 and TO247 package.
|