Chip One Stop - Shopping Site for Electronic Components and Semiconductors
Menu
Portugal
Change
English
SELECT YOUR LANGUAGE
USD
SELECT YOUR CURRENCY FOR DISPLAY
Über Vorzugs Rang / Discount

Aktueller Preis der Artikel (s) sind unten aufgetragen.


・Vorzugs Rang und Discount Rate wird nach Nutzung unserer Web-Service angewendet werden.
・Rabatt gilt nur für Bestellungen aus chip1stop Website anwendbar.
・Einige Größen und Produkte sind nicht anwendbar toPreferential Rang / Discount.
・Bitte kontaktieren Sie Ihren Vertriebsbeauftragten von Vorzugs Rank.
・Keine anderen Coupons können in Verbindung mit diesem Rabatt verwendet werden.

PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2023/05/12 PCN (Product Change Notice) Industrial grade Zener, Schottky and ESD Protection Diodes assembly
in SMF (DO-219AB) Package convert to Clip bonding

Description of Change: The assembly technology of the affected part numbers will change
from ”folded finger” to “soldered clip”.

Time Schedule: Start Shipment Date: Tue Jul 4, 2023
2024/06/19 PCN (Product Change Notice) Supplier Notice No.:PCN-DD-010-2024-REV-0
Title:
Additional In-House Backend Assembly Site for Commercial Grade Zener, Schottky and ESD Products in SMF(DO-219AB) Package

Description of Change:
Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade
products in SMF package (Case Outline: DO-219AB).

Reason for Change:
Capacity expansion and risk management

Expected Influence on Quality/Reliability/Performance:
No change in quality and reliability performance.

Time Schedule:
Start Shipment Date: Wed Jun 19, 2024
2024/11/26 PCN (Product Change Notice) Supplier Notice No.:PCN-DD-028-2024-REV-1
Title:
Additional In-House Backend Assembly Site for ESD, Zener, TVS and Rectifier Products in SMF Package

Description of Change:
Vishay Diodes Division is introducing an additional in-house manufacturing location for SMF (Case Outline: DO-219AB) in Tianjin, China. Among the affected part numbers, SL02 & SL03-GS08 & GS18 will be converted to “solder clip” assembly technology and also added to SMF production in Kaohsiung, Taiwan as they were not mentioned in previously released PCN-DD-011-2023 & PCN-DD-012-2023.

Reason for Change:
Back up capacity for risk management

Start Shipment Date:
Tue Nov 26, 2024
Click here for contact regarding final purchasing
PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Produktinformationen zu Produkten, für die eine Benachrichtigung erforderlich ist

   12345  Last  NEXT
Products: 1,620 out of cases/Show 1 to 25






   12345  Last  NEXT
Products: 1,620 out of cases/Show 1 to 25