| 2019/11/25 |
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PCN(Product Change Notice)
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Shipping tray change for select DDR3/DDR4 DRAM Components in 96b BGA 8x14mm package |
| 2024/04/23 |
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PCN(Product Change Notice)
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Supplier Notice No.:35347 Title: Micron Inner Box Label
Description: Micron is implementing several alterations to enhance the descriptive quality of the inner box label. These modifications exclusively pertain to the Micron inner box label and will not affect any custom labels. If you encounter this label type, please note the following changes: ? Elimination of grid lines. ? Revision of the barcode description from ""(S) Serial"" to ""(3S) DN#” (Delivery Note Number). ? Slight adjustments to barcode dimensions.
Target timeline for transition: Implementation will begin April 23, 2024.
Reason: Enhancements to Micron label for improved processing.
Anticipated Impact: None. |
| 2024/11/18 |
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PCN(Product Change Notice)
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Micron will be updating all packaging, DDR5 module and LPCAMM2 labels with the~new Micron logo. Any packaging, DDR5 module or LPCAMM2 labels printed after~2024-12-17 will have the new Micron logo. |
| 2025/03/27 |
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PCN(Product Change Notice)
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Micron is adding Test site Micron Memory Malaysia (MMP) for the 2Gb x8 78b and~x16 96b SDP (V89C) Automotive and Non-Automotive components as reflected below. |
| 2025/03/27 |
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PCN(Product Change Notice)
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Micron is adding assembly site Micron Memory Malaysia (MMP) for the 2Gb x16 96b~SDP DDR3 (V89C) Automotive and Non-Automotive components as reflected below. |