Realization of world’s first revolutionary new heat dissipation sheet

June 22, 2021

 Okitsumo Incorporated (Okitsumo), NICHICON CORPORATION (“NICHCON”) and KISCO Ltd.(“KISCO”) have pooled their technological resources and formed a new operational alliance for the commercialization of “VSI*,” an aluminum metamaterial heat dissipation sheet. Okitsumo has been working for many years on research and development of this revolutionary heat dissipation solution. VSI is rewriting the conventional wisdom on heat solutions. By selectively radiating the infrared wavelength emitted by a device’s heat source, it enables heat to pass through the device’s resin housing to be released externally. (VSI is a registered trademark of Okitsumo.

 

Please be refered the News document.

企业HP：
https://www.nichicon.co.jp/english/index.html

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