TAICHUNG,  Taiwan–  2023-02-15  –Winbond  has  joined  the  UCIe™  (Universal  Chiplet Interconnect Express™) Consortium, the industry Consortium dedicated to advancing UCIe technology.  This  open  industry  standard  defines  interconnect  between  chiplets  within  a package, enabling an open chiplet ecosystem and facilitating the development of advanced 2.5D/3D devices. 

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