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  2. PCN/PDN/NRND信息

PCN/PDN/NRND信息

PCN（产品/工艺变更通知）和PDN（生产中断通知）信息。

通知日期 通知文书 通知类型 通知信息
2020/09/15 PCN（产品规格变更通知） PRODUCT CHANGE NOTIFICATION
2020/12/04 PCN（产品规格变更通知） PRODUCT CHANGE NOTIFICATION
REV 2: This interim update provids a partial listing of affected part numbers for which qualification is complete for
the changes listed in the title of the tables below. An additional Diodes internal assembly and test site (SAT) in
Shanghai, China is also being added for products listed in table 4 below. Qualification / reliability reports are
attached (embedded in this file).
For other associated changes (identified in the Advance version (Rev 1) of PCN-2477 released August 17th, 2020)
qualification testing is ongoing. Updates and qualification data will be provided in the Final version of this PCN. The
final PCN is expected to be issued by January 31st, 2021 once all qualification has been completed.
2021/03/09 PCN（产品规格变更通知） 2477 REV 3 ? FINAL UPDATE : Additional Wafer Source (GFAB), Additional Assembly/Test (A/T) Site
(SAT), and Transfer Assembly/Test Site to DIYI
2022/06/08 PCN（产品规格变更通知） Diodes Incorporated has qualified additional clip bonding, lead frame structure~(Matrix), and mold compound at Diodes subcontractor Eris Technology Corp. (ERIS~located in Taoyuan City, Taiwan for select discrete products. Diodes~Incorporated has also qualified internal assembly and test (A/T) site (SSEC)~located in Shanghai, China as an additional A/T site for select products
2022/06/08 PCN（产品规格变更通知） Diodes Incorporated has qualified additional clip bonding, lead frame structure~(Matrix), and mold compound at Diodes subcontractor Eris Technology Corp. (ERIS~located in Taoyuan City, Taiwan for select discrete products. Diodes~Incorporated has also qualified internal assembly and test (A/T) site (SSEC)~located in Shanghai, China as an additional A/T site for select products
2022/09/01 PCN（产品规格变更通知） Assembly Site/Material Change
Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix)
and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC)
for Select Discrete Products
Implementation Date : 1 September, 2022
2024/05/08 PCN（产品规格变更通知） Updated document, Reason of update: Diodes Incorporated has qualified Diodes~internal wafer fabrication source (JKFAB) in Hsinchu, Taiwan as additional~wafer source for select discrete products listed.
2024/06/26 PCN（产品规格变更通知） This PCN is being issued to notify customers that in order to assure continuity of supply,
Diodes Incorporated has qualified Diodes internal wafer fabrication source (JKFAB) in Hsinchu, Taiwan
as additional wafer source for select discrete products listed below.
Top metal (TM) and back metal (BM) will be processed
at Diodes internal wafer fabrication (KLFAB) in Keelung, Taiwan.
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