| 2024/05/02 |
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PCN(产品规格变更通知)
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To improve 16SOP 300MIL package production capacity and flexibility, ASECL will EOL DCI lead frame due to long lead time and poor flexibility , at the same time, integrate with higher grade mold compound and die attach materials. Before Change : MOLD COMPOUND: Hitachi CEL 9240HF LEADFRAME: DCI DIE ATTACH: Ablestik ATB 125 (Top die), Hitachi EN 4900G (Btm Die) After Change : MOLD COMPOUND: Sumitomo EME G700 LEADFRAME: FUSHENG DIE ATTACH: Henkel ATB 125 (all die) |