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PCN/PDN/NRND信息

PCN(产品/工艺变更通知)和PDN(生产中断通知)信息。

通知日期 通知文书 通知类型 通知信息
2020/06/12 PCN(产品规格变更通知) For StatsChipPAC JSCC Jiangyin China capacity increase
Silver wire bonding > Silver wire bonding + Gold wire bonding
2021/01/08 PCN(产品规格变更通知) PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2022/05/08 PCN(产品规格变更通知) NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2024/12/04 PCN(产品规格变更通知) Supplier Notice No.:MICROCONTROLLERS/24/15033
Title:
JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products

Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly

Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change

Intended start of delivery:
2024-12-04

Intended start of delivery 2024-12-04
2024/12/04 PCN(产品规格变更通知) JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
2025/02/03 PCN(产品规格变更通知) Supplier Notice No.:PCN MDG/24/14976
Title:
JSCC (China) LQFP7x7 48L , LQFP10x10 64L package copper palladium bonding wire introduction on STM32F2x, STM32F4x and STM32F7x listed products

Description:
Old/
Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper
Palladium wire

New/
Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper
Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire

Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function

Intended start of delivery:
2025-02-03
2025/04/15 PCN(产品规格变更通知) Supplier Notice No.:MICROCONTROLLERS/25/15166
Title:
JSCC (China) - KOSTAT Carrier Tape & Cover Tape alternative packing material for TQFP7x7 & QFP10x10 package on listed products.

Description of change:
Old/
For QFP7X7, QFP10X10 packages
- E-PAK carrier tape and cover tape

New/
For QFP7X7 & QFP10X10 packages
- E-PAK carrier tape and cover tape (until depletion of current material).
- Then KOSTAT carrier tape (4-side partial fence) and cover tape.

Intended start of delivery:
2025-04-15
2026/02/04 PCN(产品规格变更通知) PCN No. EMBEDDED PROCESSING/25/15910
Change Desc.
ASE Kaohsiung (Taiwan) additional source for STM32F446x listed products in LQFP 10x10 64L package

Timing / schedule Intended start of delivery 2026-02-04
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