| 2020/04/21 |
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PCN(产品规格变更通知)
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Product/Process Change Notice - PCN 20_0126 Rev. - |
| 2020/08/26 |
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PCN(产品规格变更通知)
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Conversion of Select Sizes LFCSP Products from Punched to Sawn and Transfer of Assembly Site to ASE Korea |
| 2021/05/08 |
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PCN(产品规格变更通知)
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Conversion of Select Sizes LFCSP Products from Punched to Sawn and Transfer of Assembly Site to ASE Korea |
| 2021/05/08 |
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PCN(产品规格变更通知)
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Revision D : Add 9x9 AD5391QualificationResults Summary. |
| 2025/12/18 |
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PCN(产品规格变更通知)
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PCN No. PCN 24_0009 Rev. F Change Desc. Revision Description: Add parts. Analog Device is adding Analog Devices Beaverton OR, USA (ADBN) as an alternate Wafer Fab site to TSMC Taiwan for 0.18um Mixed Signal CMOS Process. |
| 2026/01/07 |
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PCN(产品规格变更通知)
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PCN No.: PCN 24_0009 Rev. H Change Desc.:Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process. Analog Device is qualifying Analog Devices BeavertonOR,USA(ADBN) as an alternate Wafer Fab site for 0.18umMixed Signal CMOS Process.
Reason For Change: This change will ensure manufacturing agility and continuity of suppl
Revision Description: Minor correction to the PCN description for improved accuracy. |