| 2023/10/30 |
|
PCN(Product Change Notice)
|
Introduction of an additional assembly and test site Huayi Microelectronics Co., Ltd, HYME for products in TO220 3L packages. Intended start of delivery 2023-10-30 or earlier on specific customer request |
| 2024/10/22 |
|
PCN(Product Change Notice)
|
Introduction of an additional wafer production location at Infineon Technologies Dresden Gmbh and change of wafer size from 200mm to 300mm for IGBT3 600/650V
Time schedule Intended start of delivery 2025-01-31 |
| 2025/09/16 |
|
PDN(Product Discontinuation Notice)
|
PDN No.: PD_280_25 Description: Products have reached end of life |