| 2024/11/12 |
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PCN(产品规格变更通知)
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Qualification of MTAI as a new final test site for AT27C1024-45JU, AT27C1024-45JU-T, AT27C1024-70JU, AT27C1024-70JU-T, AT27C4096-90JU, AT27C4096-90JU-T, AT27C4096-55JU, and AT27C4096-55JU-T catalog part numbers (CPN) available in 44L PLCC (16.6x16.6x4.4mm) package.
Estimated Qualification Completion Date:December 2024 |
| 2025/07/22 |
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PCN(产品规格变更通知)
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PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 7/9th notification. |